XwinSys’s unique and patented multi-mode technology system meets both fast in-line and in-depth metrology challenges, without interrupting the process flow. http://www.xwinsys.com/
Doron Reinis, Chief Operating Officer stated, “This is a case where the whole is greater than the sum of its parts – the integrated sensors create an innovative wholistic approach to problem solving and product monitoring – a disruptive technology that replaces the need for off-line analytical tasks.”
Bruce Rowlands, Chairman and Chief Executive Officer, added, “XwinSys is ideally positioned to supply a revolutionary solution to a critical need in the newly emerging field of 3D interconnects in 3D integrated circuit stacks.”
XwinSys will be presenting the hybrid technology and its portfolio of solutions at SEMICON West 2016, the world’s marketplace for microelectronics innovation and largest conference and exhibition for the semiconductor industry. The Conference and Exhibition is being held at the Moscone Center, San Francisco from July 12th through July 14th, 2016. XwinSys will be exhibiting in the South Hall, booth # 2245.